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爱克森电子有限公司
地址:中国广东省深圳市宝安区福永凤凰东
区B178栋
电话:+86-755-29974750
传真:+86-755-29974750
联络人：Violet
Msn:akesioncircuit@gmail.com
SKYPE:akesoncircuit-sale
移动电话:+86 13410525760
Email:sale1@akesoncircuit.com.cn
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Rigid Board capability:
| 序 号 |
项 目
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技术指标 |
| 1 |
层 数 |
1－22（层） |
| 2 |
最大加工面积 |
457 x 610 mm |
| 3 |
最小板厚 |
4（层） 0.40mm |
| 6（层） 0.80mm |
| 8（层） 1.00mm |
| 10（层）1.20mm |
| 4 |
最小线宽 |
0.10mm |
| 5 |
最小间距 |
0.10mm |
| 6 |
最小孔径 |
0.20mm |
| 7 |
孔壁铜厚 |
0.020mm |
| 8 |
金属化孔径公差 |
±0.05mm |
| 9 |
非金属化孔径公差 |
±0.025mm |
| 10 |
孔位公差 |
±0.05mm |
| 11 |
外形尺寸公差 |
±0.1mm |
| 12 |
最小焊桥 |
0.08mm |
| 13 |
绝缘电阻 |
1E+12Ω（常态） |
| 14 |
板厚孔径比 |
10 : 1 |
| 15 |
热冲击 |
288 ℃（10秒3次） |
| 16 |
扭曲和弯曲 |
≤0.7% |
| 17 |
抗电强度 |
＞1.3KV/mm |
| 18 |
抗剥离强度 |
1.4N/mm |
| 19 |
阻焊剂硬度 |
≥6H |
| 20 |
阻燃性 |
94V-0 |
| 21 |
阻抗控制 |
±5% |
Flex board capability:
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Technical Specification |
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Materials |
Polyimide/Polyester
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Remark&Test Method |
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Number of Layer |
FPCB 1-8/Rigid-flex:3-10 |
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Min.Trace
Width/Space |
Single Side |
0.050mm(2mil) |
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Double Side |
0.050mm(2mil) |
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Min.Hole
Diameter |
Drilling(P.T.H.) |
φ0.15mm |
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Punching |
φ0.50mm |
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Dimension
Tolerance |
Conductor Width |
20% |
W≤0.5mm |
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Hole Diameter(H) |
0.05mm |
H≤1.5mm |
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Accumulated
Pitch |
0.05mm |
P≤25mm |
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Outline Dimension |
±0.1mm |
L≤50mm |
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Conductors And
Outline |
±0.07mm |
C≤5.0mm |
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Surface Treatment On Terminal
And Land Area |
Au(0.03-1.5um) |
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Ni(1-6um) |
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Sn(7-20um) |
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Peeling Strength(180° Direction) |
1.0kg f/cm |
IPC-TM-650 2,4,9 |
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Solder Heat Resistance |
260℃/10 secs |
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